3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2 designates a family of
thermosetting modified epoxy structural adhesives in film form which are available
in a variety of weights with or without a supporting carrier. Scotch-Weld AF 163-2
Films are designed for both solid panel and honeycomb sandwich constructions.
Advantages :
- High bond strength from -67°F to 250°F
- High fracture toughness and peel strength
- Excellent resistance to high moisture environments before and after curing
- Short cure time at 225°F (90 minutes)
- Capable of low pressure bonding
- Vacuum cure capability
- X-ray opaque (allows use of x-ray NDI methods)
- Excellent shop open time and long shelf life
- Scotch-Weld AF 163-3M Film is a higher tack version of Scotch-Weld AF 163-2 Film
- Isolating version available (Scotch-Weld AF 163-2G108 Film) for bonding dissimilar
substrates
- Unsupported versions available for reticulation (Scotch-Weld AF 163-2U Film)
