Scotch-WeldTM
Structural Adhesive Film
AF 163-2
3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2 designates a family of
thermosetting modified epoxy structural adhesives in film form which are available
in a variety of weights with or without a supporting carrier. Scotch-Weld AF 163-2
Films are designed for both solid panel and honeycomb sandwich constructions.
Advantages :
- High bond strength from -67°F to 250°F .
- High fracture toughness and peel strength .
- Excellent resistance to high moisture environments before and after curing .
- Short cure time at 225°F (90 minutes) .
- Capable of low pressure bonding .
- Vacuum cure capability .
- X-ray opaque (allows use of x-ray NDI methods) .
- Excellent shop open time and long shelf life .
- Scotch-Weld AF 163-3M Film is a higher tack version of Scotch-Weld AF 163-2 Film .
- Isolating version available (Scotch-Weld AF 163-2G108 Film) for bonding dissimilar
substrates .
- Unsupported versions available for reticulation (Scotch-Weld AF 163-2U Film)
