DOWSIL™/Dow Corning® 340 Heat Sink Compound .
White, non-curing and non-flowing thermally conductive
compound.
Features :
- Non-flowing .
- Moderate thermal conductivity .
- No need for ovens or curing .
- Heat flow away from electronic
components can increase reliability .
Applications :
- Dow Corning® 340 Heat Sink Compound is suitable for thermal coupling of
electrical/electronic devices to heat sinks.
