CHO-BOND 1038 is a silver-plated copper f illed, one-component conductive silicone. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. Minimum recommended bond line for CHOBOND 1038 is 0.007 inches (0.18mm). In addition, CHO-BOND 1038 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (less than 150 psi) is required. CHO-BOND 1038’s moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures. For applications requiring zero volatile organic compounds (VOCs) or minimal shrinkage, Parker Chomerics offers a solvent free version of CHO-BOND 1038 called CHO-BOND 1121.
Features and Benefits:
- One component
- Silver plated copper filler
- Moisture cure silicone
- Easy to use, no weighing or mixing required.
- Excellent conductivity 0.010 ohm-cm
