CHO-BOND 1030 is a silver plated copper
filled, one-component conductive silicone
designed for applications where a flexible,
strong, conductive electrical bond must
be achieved. CHO-BOND 1030 greatly
simplifies the problem of bonding conductive
silicone EMI gaskets to metal substrates.
It is formulated for relatively small bond
lines (less than 0.010 inches (0.25mm)), and
should not be used as an EMI caulk where
bond lines are greater than 0.10 inches (0.25
mm). No volatile organic compounds (VOCs)
and minimal shrinkage upon curing make
CHO-BOND 1030 a good choice for a variety of
commercial and military applications. CHOBOND
1030’s moisture cure silicone polymer
system allows it to cure to the touch in 24hrs
and provides a robust conductive bond over a
wide range of application temperatures.
For best adhesion results, CHO-BOND 1030
should be used in conjunction with CHOSHIELD
1086 primer. Typical applications
include bonding, repair, and attachment of EMI
gaskets, and sealing around EMI vents and
windows.
