ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag paste epoxy adhesive that can be used with a variety of catalysts.
Features :
- Thermal conductivity - Dissipation of heat from bonded components
- Thixotropic paste - No flow or sag even on vertical surfaces
- Wide variety of catalysts available - Versatility of resin sustem
- Low coefficient of thermal expansion - Low stress on bonded components
