3M™ Scotch-Weld™ Structural Adhesive Film AF 191
- Designed for 350°F cure (175°C)
- Adhesive can be cured from 275°F (135°C) up to 350°F (175°C)
- Excellent elevated temperature performance
- Unsupported version available for reticulation
- High-fracture toughness and peel strength
- Available with lightweight conductive screen for lightning strike/composite surfacing
Our 3M™ Scotch-Weld™ Structural Adhesive Film AF 191 encompasses a family of thermosetting modified epoxy adhesives in film form that provide long-term durability and meet specific challenges for metal and composite solid panel and honeycomb sandwich construction, where high fracture toughness and peel strength is required.
