ECCOBOND 57 C is a two component epoxy based,
room temperature curing conductive adhesive.
When fully cured, it has a volume resistivity typically
6 x 10-4 Ohm.cm, yet has a bond strength in shear of
over 4,8 MPa.
It is supplied as a two component paste with
convenient 1 to 1 mix ratio. Only contact pressure is
needed. Cure is accomplished in a few hours at
room temperature or in minutes at elevated
temperature
Applications :
ECCOBOND 57 C is used in applications where
conventional hot soldering is impractical : some
electronic components cannot be heated excessively,
conventional solder will not bond to nichrome wire or
conductive plastics, some materials will deform when
hot soldered. In certain thermally conductive
applications, ECCOBOND 57 C can also be used.
