CHO-BOND® 584-29
TWO COMPONENT EASY TO USE CONDUCTIVE
EPOXY ADHESIVE
CHO-BOND 584-29 is a two-component, silver
filled conductive epoxy adhesive system designed
for applications where a strong, highly conductive
electrical bond must be achieved. CHO-BOND
584-29 is recommended for relatively small bond
lines (less than 0.010 inches (0.25mm)), but can be
used for larger bond lines in applications where
vibration or potential for cracking is not an issue.
The fine silver filler of CHO-BOND 584-29 make it
a good material choice for precise application in
and around tight spaces and electrical components.
CHO-BOND 584-29 comes in a variety of sizes and
packaging so customers can choose a package and
material size which is right for their application,
minimizing material scrap and mixing issues.
Curing of CHO-BOND 584-29 can be achieved
in as little as 15 minutes with heat to minimize
equipment downtime and increase manufacturing
throughput. Typical applications include bonding
and grounding of electrical components, cold
soldering, and bonding and sealing machined
enclosures.
Features and Benefits:
- Two component
- Fast heat cure, increases throughput,
minimizes equipment downtime.
- Silver filler
- Excellent conductivity 0.002 ohm-cm
- Epoxy
- 30 minute working life, works well over
wide temperature range, good chemical
resistance >1200 psi lap shear, good for
permanently bonding surfaces.
- Multiple packaging
options
- No weighing required, mix and dispense
in same package, minimizes process
scrap.
- Thin paste
- May be dispensed out of very small
needles, fill small cracks and voids.
- Low VOCs
- Minimal shrinkage
