CHO-BOND 584-208 is a two-component,
silver filled conductive epoxy adhesive
system designed for applications where a
strong, highly conductive electrical bond
must be achieved. CHO-BOND 584-208 is
recommended for applications which require
a conductive epoxy with an extended working
life such as high volume part dispensing or
complex part assembly operations.
Curing of CHO-BOND 584-208 can be
achieved in as little as 45 minutes with
heat to minimize equipment downtime and
increase manufacturing throughput. With a
1:1 weight mix ratio, CHO-BOND 584-208 is
easy to handle and use. Typical applications
include bonding and grounding of electrical
components, cold soldering, and bonding and
sealing machined enclosures.
Features and Benefits :
- Two component
- Fast heat cure, increases
throughput,
minimizes equipment downtime.
- Silver filler
- Epoxy
- 1:1 Weight mix ratio
-Medium paste
- No VOCs
- Good conductivity 0.002 ohm-cm
- 60 minute working life, works well over
wide temperature range, good chemical
resistance >1000 psi lap shear, good for
permanently bonding surfaces.
- Easy to weigh out and mix
- May be dispensed out of very small
needles, fill small cracks and voids. Can
be used on overhead or vertical surfaces
- Minimal shrinkage, no permits or
ventilation required
