ResinLab® Armstrong™ A-661 is a two-part room temperature curing adhesive that produces bonds with excellent shear
strength and will maintain its performance after long term exposure to temperatures up to 400 °F / 205 °C.
Armstrong A-661 is a smooth, brushable, non-sag, easy to apply paste that cures to handling strength overnight at room
temperature. An elevated cure schedule at or above 165 °F (75 °C), for example 10 minutes @ 150 °C, can be used to
accelerate final properties.
