Parker Chomerics CHO-BOND primers 1085
and 1086 are air-drying liquid coatings used
to improve the adhesion of Parker Chomerics
CHO-BOND conductive silicone compounds
to metal and other non-silicone substrates.
The primers are moisture reactive and
clear in color. CHO-BOND 1085 primer is
formulated to achieve maximum adhesion
on non-silicone substrates for CHO-BOND
1029 adhesive. CHO-BOND 1086 primer
is formulated for use with CHO-BOND
1016,1030, 1035, 1038, 1075 electrically
conductive adhesives/sealants and CHOTHERM®
1641 thermal compound.
Note that typically, the proper primer comes
bundled as a “kit” with the CHO-BOND or
CHO-THERM compound ordered. However,
if extra primer is deemed necessary, then
part numbers for just the primer are provide
in Table 2. See the Conductive Compounds
Selector Guide for a more detailed listing of
which CHO-BOND adhesive / sealant part
numbers come packaged as a kit with the
primer and which do not.
